Power consumption measurement assembly and method, and chip power consumption measurement device

ABSTRACT

A power consumption measurement assembly includes: at least two sampling modules respectively connected to a circuit to be measured in series; a gating module configured to gate one of the at least two sampling modules; an amplifying module configured to acquire and amplify a voltage signal across the gated sampling module; and a processing module connected to the gating module and the amplifying module and configured to: control and adjust the gated sampling module and an amplification of the amplifying module, calculate a power consumption value based on the amplified voltage signal and transmit the power consumption value.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation of International Patent Application No.PCT/CN2021/103724 filed on Jun. 30, 2021, which claims priority toChinese Patent Application No. 202011058673.4 filed on Sep. 30, 2020.The disclosures of these applications are hereby incorporated byreference in their entirety.

BACKGROUND

Generally, a power consumption of a chip is an essential performanceparameter in both chip design and operation phases. A chip with greatpower consumption has a great influence on various aspects such as heatradiation and operation environment. Therefore, it is very important tomeasure the power consumption.

SUMMARY

Embodiments of the disclosure relate to the field of integrated circuittechnologies, in particular to a power consumption measurement assemblyand a method, and a chip power consumption measurement device.

According to an aspect of embodiments of the disclosure, a powerconsumption measurement assembly is provided and applied to a circuit tobe measured, and the power consumption measurement assembly includes atleast two sampling circuitries, a gating circuitry, an amplifyingcircuitry and a processing circuitry.

The at least two sampling circuitries are respectively connected to thecircuit to be measured in series.

The gating circuitry is configured to gate one of the at least twosampling circuitries.

The amplifying circuitry is configured to acquire and amplify a voltagesignal across the gated sampling circuitry.

The processing circuitry is connected to the gating circuitry and theamplifying circuitry, and configured to control and adjust the gatedsampling circuitry and an amplification of the amplifying circuitry,calculate a power consumption value based on the amplified voltagesignal and transmit the power consumption value.

According to an aspect of the embodiments of the disclosure, a powerconsumption measurement method is provided and is applied to a powerconsumption measurement assembly, and the method includes the followingoperations.

A gated sampling circuitry and an amplification of an amplifyingcircuitry of the power consumption measurement assembly are controlledand adjusted.

A voltage signal across the gated sampling circuitry is acquired andamplified.

A power consumption value is calculated based on the amplified voltagesignal, and the power consumption value is transmitted.

According to an aspect of the embodiments of the disclosure, a chippower consumption measurement device is provided and includes a chip anda power consumption measurement assembly. The power consumptionmeasurement assembly includes at least two sampling circuitries, agating circuitry, an amplifying circuitry and a processing circuitry.The at least two sampling circuitries are respectively connected to thechip in series. The gating circuitry is configured to gate one of the atleast two sampling circuitries. The amplifying circuitry is configuredto acquire and amplify a voltage signal across the gated samplingcircuitry. The processing circuitry is connected to the gating circuitryand the amplifying circuitry, and configured to control and adjust thegated sampling circuitry and an amplification of the amplifyingcircuitry, calculate a power consumption value based on the amplifiedvoltage signal and transmit the power consumption value.

The at least two sampling circuitries of the power consumptionmeasurement assembly are respectively connected to a power supply pin ofthe chip in series.

It should be understood that above general description and the detaileddescription below are only illustrative and explanatory and not intendedto limit the embodiments of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate embodiments consistent with theembodiments of the disclosure and, together with the description, serveto explain the principles of the embodiments of the disclosure. It isapparent that the accompanying drawings described below are merely someof the embodiments of the disclosure , based on which other drawings maybe obtained by a person of ordinary skill in the art without anycreative effort.

FIG. 1 schematically illustrates a schematic diagram of a structure of apower consumption measurement assembly according to an exemplaryimplementation of the embodiments of the disclosure.

FIG. 2 schematically illustrates a flowchart of a power consumptionmeasurement method according to an exemplary implementation of theembodiments of the disclosure.

FIG. 3 schematically illustrates a flowchart of a state conversionprocedure on a processing module according to an exemplaryimplementation of the embodiments of the disclosure.

FIG. 4 schematically illustrates a flowchart of a procedure on an uppercomputer according to an exemplary implementation of the embodiments ofthe disclosure.

FIG. 5 schematically illustrates a schematic diagram of a structure of achip power consumption measurement device according to an exemplaryimplementation of the embodiments of the disclosure

FIG. 6 schematically illustrates a schematic diagram of a structure ofanother chip power consumption measurement device according to anexemplary implementation of the embodiments of the disclosure.

DETAILED DESCRIPTION

Exemplary embodiments will now be described more fully with reference tothe accompanying drawings. However, the exemplary embodiments can beimplemented in various forms and should not be understood as beinglimited the examples set forth herein, rather, these embodiments areprovided to make the embodiments of the disclosure more thorough andcomplete, and to fully convey the concepts of the example embodiments tothose skilled in the art. The same reference numbers in the drawing areused to depict the same or similar structures, so their detaileddescription will be omitted.

Although terms such as “on” and “below” are used in the disclosure todescribe a relative relationship between an assembly and anotherassembly referenced in the drawings, these terms are only used for easeof description, for example, according to an example directionillustrated in the drawings. It should be understood that if the devicereferenced in the drawings is turned upside down, the assembly describedas “on” others will become an assembly “below” others. Other relativeterms, such as “high, “low”, “top”, “bottom”, “left” and “right” alsohave similar meanings. A structure “on” another structure may mean thatthe structure is integrally formed on said another structure, or thestructure is “directly” arranged on said another structure or“indirectly” arranged on said another structure through otherstructures.

Terms like “one”, “a/an”, “the” are intended to describe one or moreelements/constituent components/etc. Terms like “include/includes” and“have/has” are intended to express an open including which may includeadditional elements/constituent components/etc., in addition to thelisted elements/constituent components/etc.

A Synchronous Dynamic Random-Access Memory (SDRAM) is a commonsemiconductor memory device used in computers. Since a power supplyvoltage of the SDRAM chip is fixed, only a current needs to be measuredwhen measuring the power consumption of a power supply group on theSDRAM chip. The traditional current measurement method comprisesconnecting a current sampling resistor to a power supply signal inseries, measuring a voltage drop across the current sampling resistor bya multimeter or an oscilloscope, and dividing the voltage drop by aresistance value of the current sampling resistor to calculate thecurrent.

In the field of integrated circuit technologies, particularly in aprocess of designing embedded systems, the calculation of powerconsumption is an inevitable problem. In the process of calculation ofthe power consumption, the power consumption of dynamic random memories,such as the SDRAM, a Double Data Rate SDRAM (DDR SDRAM), a Double DataRate 2 SDRAM (DDR2 SDRAM) are especially difficult to be obtained andcalculated. Moreover, the traditional current measurement method cannotsatisfy requirements of an excessively large current dynamic range ofvarious power groups in the SDRAM chip.

With respect to a chip, an important premise of reducing the powerconsumption of the chip is detection of the power consumption of thechip. In an exemplary implementation of the embodiments of thedisclosure, a power consumption measurement assembly is provided andused for measurement of the power consumption. The power consumptionmeasurement assembly is able to be used not only for measurement of thepower consumption of the above SDRAM chip (such as SDR, DDR-DDR5, LowPower Double Data Rate (LPDDR)-LPDDR5), but also for measurement ofother chips such as a Central Processing Unit (CPU) chip and a chip of acalorimeter. The power consumption measurement assembly is especiallysuitable for devices with a wide changing range of the powerconsumption.

For the chip, static power consumption and dynamic power consumption aretwo main power consumption sources. The dynamic power consumption comesfrom turnover power consumption and short-circuit power consumption whenload capacitor is charged and discharged. The static power consumptioncomes from: a sub-threshold leakage current flowing through a cut-offtransistor, a leakage current flowing through a gate dielectric, aleakage current in a source-drain diffusion region, and a competitivecurrent in a ratio circuit. The power consumption measurement assemblyprovided in the exemplary implementation of the embodiments of thedisclosure can be used for measurement of both the dynamic powerconsumption and the static power consumption.

The power consumption measurement assembly in the exemplaryimplementation of the embodiments of the disclosure is described belowin combination with specific embodiments.

Referring to FIG. 1, FIG. 1 schematically illustrates a schematicdiagram of a structure of a power consumption measurement assemblyaccording to an exemplary implementation of the embodiments of thedisclosure. As illustrated in FIG. 1, the power consumption measurementassembly 100 provided in the exemplary implementation is applied to acircuit to be measured 110. Herein, the circuit to be measured 110 maybe a circuit of which the power consumption needs to be measured, suchas a power supply circuit in the SDRAM chip.

In an exemplary implementation of the embodiments of the disclosure, thepower consumption measurement assembly 100 specifically includes: aprocessing module 120, an amplifying module 130, a gating module 140 andat least two sampling modules 150. The at least two sampling modules 150are respectively connected to the circuit to be measured 110 in series;the gating module 140 is configured to gate one of the at least twosampling modules; the amplifying module 130 is configured to acquire andamplify a voltage signal across the gated sampling module 150; and theprocessing module 120 is connected to the gating module 140 and theamplifying module 130 and is configured to: control and adjust the gatedsampling module 150 and an amplification of the amplifying module 130,calculate a power consumption value based on the amplified voltagesignal, and transmit the power consumption value.

In an exemplary implementation of the embodiments of the disclosure, theat least two sampling modules 150 are respectively connected to thecircuit to be measured 110 in series, an appropriate sampling module 150may be selected based on an actual changing range of a current of thecircuit to be measured 110. In such way, measurement accuracy can beincreased, and a measurement range of the current flowing through thecircuit to be measured 110 can also be increased. Therefore, a largercurrent dynamic range of a device such as the SDRAM chip in differentoperating conditions can be measured.

In a practical application, the at least two sampling modules 150 may beat least two sampling resistors, and the at least two sampling resistorsmay have different resistance values, the different resistance valueswill result in different voltage drops. When the current of the circuitto be measured 110 is relatively small, the sampling module 150 with alarger resistance value may be selected to increase the voltage dropacross the sampling module 150, and thus a more accurate result can beobtained. When the current of the circuit 100 to be measured isrelatively large, the sampling module 150 with a smaller resistancevalue may be selected, thus the voltage drop across the sampling module150 can be reduced while a more accurate result is obtained, andrequirements of operating voltage of the chip 300 can be satisfied.

In a practical application, a resistance value range of the samplingresistor may be set based on the actual requirements. For example, in anexemplary implementation of the embodiments of the disclosure, theresistance value range of each of the at least two sampling resistorsmay be 50 mΩ- 10Ω. It is to be noted that any resistance value range ofthe sampling resistor satisfying the measuring requirements shall fallwithin the scope of the embodiments of the disclosure.

In a practical application, a number of the sampling modules 150 may betwo, three or more. The specific number of the sampling module 150 maybe determined based on an actual range of the current to be measured ofthe circuit to be measured 110. When the actual current range is verylarge, a plurality of sampling modules 150 with different resistancevalues may be provided.

In an exemplary implementation of the embodiments of the disclosure,since the power supply voltage on the chips such as the SDRAM chip arefixed, the above sampling module 150 may be a current sampling resistorand is mainly configured to measure the current of the circuit to bemeasured 110, and the power consumption may be obtained by a product ofthe above current and the power supply voltage. Compared with thevoltage sampling resistor, the current sampling resistor has a smallerresistance value and a smaller power consumption, which can reduce thepower consumption in the measurement process.

In an exemplary implementation of the embodiments of the disclosure, thegating module 140 is provided in the power consumption measurementassembly 100, the gating module 140 is arranged on the circuit to bemeasured 110 and is configured to gate one of at least two samplingmodules. For example, the gating module 140 may be arranged between thepower supply of the circuit to be measured 110 and the sampling module150, to switch between signals of the at least two sampling modules 150.

In a practical application, the gating module 140 may be, for example,an analog switch, a relay or a photoelectric switch. Herein, the analogswitch may use a switching manner of a Metal Oxide Semiconductor (MOS)transistor to turn off or turn on a signal link, so as to achieve higherturn-off impedance and lower conduction impedance. For example, theresistance value of the gating module 140 may be 5 mΩ when the gatingmodule 140 is turned on, and the resistance value may be greater than 10KΩ when the gating module 140 is turned off, which are not specificallylimited in the exemplary implementation.

In an exemplary implementation of the embodiments of the disclosure, thevoltage signal across the gated sampling module 150 may be amplified bythe amplifying module 130 provided in the power consumption measurementassembly 100. Therefore, the processing module 120 is able to acquireand identify the voltage signal, which provides a basis for the samplingmodule 150 to acquire a smaller current, in such way, the current rangeof the circuit 110 to be measured that can be measured by the powerconsumption measurement assembly 100 can be increased.

In an exemplary implementation of the embodiments of the disclosure, theamplifying module 130 includes at least two optional amplifications. Themeasurable current range of the power consumption measurement assembly100 may be expanded by using different sampling modules 150 anddifferent amplifications, therefore, more requirements of the currentmeasurement range can be satisfied. The amplifying module 130 may be avariable gain amplifier.

In a practical application, the amplification of the amplifying module130 may be set according to actual needs. For example, in an exemplaryimplementation of the embodiments of the disclosure, the amplificationof the amplifying module 130 may be 10 times-200 times. It is to benoted that any amplification of the amplifying module 130 satisfying themeasuring requirements shall fall within the scope of the embodiments ofthe disclosure.

In a practical application, the amplification of the amplifying module130 may be adjustable, and a number and values of the amplifications maybe determined based on the current range of the circuit to be measured110. For example, in an exemplary implementation of the embodiments ofthe disclosure, the amplifying module 130 of the power consumptionmeasurement assembly 100 has at least two optional amplifications, forexample, 10 times and 100 times. In a case where the voltage input tothe amplifying module 130 is 1 mV, and the amplification is 10 times,the voltage output by the amplifying module 130 is 10 mV, and when theamplification is 100 times, the voltage output by the amplifying module130 is 0.1V. The specific amplification of the amplifying module 130 isnot specifically limited in the exemplary implementation.

In an exemplary implementation of the embodiments of the disclosure, theamplifying module 130 has at least two channels 131, and the at leasttwo channels are configured to acquire the respective voltage dropsacross different sampling modules 150. Herein, an input of each of thechannels 131 is connected to two ends of a respective one of the atleast two sampling modules 150, and an output of each of the channels131 is connected to a respective one of analog-digital converters 121.In other words, an input of one of the channels 131 is connected to twoends of one of the at least two sampling modules 150, and the output ofsaid one channel 131 is connected to one of the analog-to-digitalconverters 121; an input of another one of the channels 131 is connectedto two ends of another one of the sampling modules 150, and the outputof said another channel 131 is connected to another one of theanalog-to-digital converters 121.

In an exemplary implementation of the embodiments of the disclosure, theprocessing module 120 is also arranged in the power consumptionmeasurement assembly 100. The processing module (such asmicrocontrollers) 120 is an integrated circuit chip, which integrates acentral processing unit with data processing ability, a random accessmemory, a read-only memory, a plurality of I/O ports and interruptsystem, a timer/counter function (may further include a display drivecircuit, a pulse width modulation circuit, an analog multiplexer, andthe analog-digital converter) into a small and perfect microcomputersystem formed on a silicon wafer by adopting a very large scaleintegration circuit technology. The voltage signal amplified by theamplifying module 130 may be acquired and identified by the processingmodule 120, and the voltage signal is converted into a digital signal,then the power consumption value is calculated based on the digitalsignal, and the power consumption value is transmitted to an uppercomputer 200, etc.

In an exemplary implementation of the embodiments of the disclosure, theprocessing module 120 is connected to the gating module 140, to controlthe gating module 140 to gate a required sampling module 150, and thusthe appropriate sampling module 150 can be selected from the at leasttwo sampling modules 150. In addition, the processing module 120 is alsoconnected to the amplifying module 130 to control the amplification ofthe amplifying module 130, in such way, the appropriate sampling module150 and appropriate amplification can be selected according to theactual current flowing through the circuit to be measured 110.Therefore, requirements of the current measurement of the circuit to bemeasured can be satisfied while a voltage drop range of the samplingmodule 150 is satisfied, moreover, the power consumption can be reducedand the energy can be saved.

Compared to an external device, such as the multimeter/oscilloscope,which has a poor data processing and data analysis ability, the powerconsumption measurement assembly 100 according to the exemplaryimplementation of the embodiments of the disclosure is provided with theprocessing module 120, thus the power consumption measurement assembly100 can implement control such as gating the sampling module 150,selecting the amplification and data processing and analysis by itself,and there may no need to connect with other external devices. Moreover,the power consumption measurement assembly has a better data processingand analysis ability, a faster processing speed and a higher accuracy.

In an exemplary implementation of the embodiments of the disclosure, theprocessing module 120 includes: an analog-digital converter 121, acalculation module, a serial port 122 and a control logic module. Theanalog-digital converter 121 is connected to the amplifying module 130and configured to convert the voltage signal into a digital signal, soas to facilitate the operation of the calculation module. Thecalculation module is configured to calculate the power consumptionvalue based on the digital signal. The serial port 122 is configured toconnect to the upper computer 200 and transmit the power consumptionvalue to the upper computer 200. The control logic module is configuredto control and adjust the gated sampling module 150 and theamplification of the amplifying module 130.

Specifically, the control logic module is configured to determine thegated sampling module 150 and the amplification of the amplifying module130 based on a current range of the circuit to be measured 110, aconvertible voltage range of the analog-digital converter 121 and avoltage drop range of the gating module 140 and the gated samplingmodule 150.

In a practical application, two analog-digital converters 121 may beprovided, and one analog-digital converter 121 corresponds to oneamplifying module 130, so as to convert the analog voltage signal whichis amplified by the amplifying module 130 and is continuous in time andamplitude into the digital signal which is discrete in time andamplitude.

Generally, the analog-digital converter 121 has a convertible voltagerange, and the voltage signal amplified by the amplifying module 130needs to meet the convertible voltage range. In a practical application,the convertible voltage range of the analog-digital converter 121 may be10 mV-2V, which is not specifically limited in the exemplaryimplementation.

In an exemplary implementation of the embodiments of the disclosure, thecalculation module may calculate the current I of the circuit to bemeasured 110 based on the above digital signal in combination with theresistance value R of the sampling module 150, further, in combinationwith the power supply voltage U of the power supply, the powerconsumption value P=I×U of the power supply may be calculate.

In an exemplary implementation of the embodiments of the disclosure, theserial port 122 may be a Universal Asynchronous Receiver/Transmitter(UART), to adapt to a situation of short distance and low rate. Inaddition, the serial port 122 may also be other synchronized serialports, which is not specifically limited in the exemplaryimplementation.

In a practical application, in order to facilitate the communicationbetween the

UART and the upper computer 200, a Universal Serial Bus (USB)-to-serialmodule is required to connect the UART with a USB interface of the uppercomputer 200.

Optionally, the processing module 120 may be a single-chipmicrocomputer.

The single-chip microcomputer may be a single-chip microcomputer with orwithout a analog-digital converter. In an exemplary implementation ofthe embodiments of the disclosure, in order to reduce a volume of thepower consumption measurement assembly 100, the processing module 120may be selected from a single-chip microcomputer internally providedwith a crystal oscillator and the analog-digital converter.

In an exemplary implementation of the embodiments of the disclosure, thepower consumption measurement assembly 100 further includes a substrate.The at least two sampling modules 150, the gating module 140, theamplifying module 130 and the processing module 120 are arranged on thesubstrate. A size and shape of the substrate are determined based on atotal area occupied by components to be arranged on the substrate, andthe substrate may be a copper-clad laminate, which is not specificallylimited in the exemplary implementation.

In an exemplary implementation of the embodiments of the disclosure, anumber of the power consumption measurement assemblies 100 may bedetermined based on a number of the power supply signals to be measuredin the chip 300, specifically, one power signal corresponds to one powerconsumption measurement assembly 100.

According to the power consumption measurement assembly 100 in theexemplary embodiments, in an aspect, at least two sampling modules 150are respectively connected to the circuit to be measured 110 in series,the current measurement range of the power consumption measurementassembly 100 can be increased and more types of current changes of thecircuit to be measured 110 can be satisfied. In another aspect, thevoltage signal across the sampling module 150 is amplified by theamplifying module 130, to facilitate the processing module 120 toacquire and identify the voltage signal. On such basis, the samplingmodule 150 can acquire smaller currents, and the current measurementrange of the power consumption measurement assembly 100 can be furtherincreased, and more requirements can be satisfied. In yet anotheraspect, in the exemplary implementations, the power consumptionmeasurement assembly 100 is provided with the processing module 120, theappropriate sampling module 150 and appropriate amplification can beselected according to the actual current of the circuit to be measured110. Therefore, requirements of the current measurement can be satisfiedwhile a voltage drop range of the sampling module 150 is satisfied.Moreover, the components used in the power consumption measurementassembly 100 are common components, instead of high-end currentmeasurement components with a high precision, therefore, the measurementcost of the measurement assembly is relatively low, and the powerconsumption can be reduced and the energy can be saved.

In an exemplary implementation of the embodiments of the disclosure, apower consumption measurement method is further provided. Referring toFIG. 2, FIG. 2 schematically illustrates a flowchart of a powerconsumption measurement method according to an exemplary implementationof the embodiments of the disclosure. As illustrated in FIG. 2, thepower consumption measurement method is applied to the above powerconsumption measurement assembly 100. Specifically, the method isexecuted by the control logic module in the power consumptionmeasurement assembly 100. The power consumption measurement methodspecifically includes the following operations.

At S210, a gated sampling module of the power consumption measurementassembly and an amplification of an amplifying module of the powerconsumption measurement assembly are controlled and adjusted.

At S220, A voltage signal across the gated sampling module is acquiredand amplified.

At S230, A power consumption value is calculated based on the amplifiedvoltage signal, and the power consumption value is transmitted.

According to the power consumption measurement method in the exemplaryimplementation, in an aspect, different sampling modules may be gated byadjusting and the amplification of the amplifying module may beadjusted, the current measurement range can be increased, and more typesof current changes of the circuit to be measured 110 can be satisfied.In another aspect, the appropriate sampling module and appropriateamplification can be selected according to the actual current of thecircuit to be measured. Therefore, requirements of the currentmeasurement can be satisfied while a voltage drop range of the samplingresistor is satisfied, moreover, the power consumption can be reducedand the energy can be saved.

In the exemplary implementation, gating of the sampling module 150 isrealized by selecting different channels by the gating module 140. Thepower consumption measurement method may specifically include thefollowing operations.

The operation of controlling and adjusting the gated sampling module 150and the amplification of the amplifying module 130 may specificallyinclude the following actions.

A current acquiring operation is performed, and the current acquiringoperation includes controlling the gating module 140 of the powerconsumption measurement assembly 100 to gate the sampling module 150 andcontrolling the amplification of the amplifying module 130.

The amplifying module 130 is controlled to acquire and amplify thevoltage signal across the gated sampling module 150.

A current value and a power consumption value corresponding to theamplified voltage signal are calculated.

The current value is compared with a measurable current range of thepower consumption measurement assembly.

In response to the current value being in the measurable current range,the power consumption value is transmitted and the current acquiringoperation is proceeded to be performed.

In response to the current value being not in the measurable currentrange, at least one of the gated sampling module or the amplification ofthe amplifying module is adjusted, and the current acquiring operationis proceeded to be performed.

In a practical operation process, a number of the used sampling modules150 and the amplification of the amplification module 130 may bespecifically determined based on the current range of the circuit to bemeasured, and different measurable current ranges may be obtainedthrough the combination of the number and the amplification. Then, thecurrent range of the circuit to be measured may be obtained through acombination of different measurable current ranges, to enable the powerconsumption measurement assembly 100 to meet the requirements of a fullrange of the circuit to be measured.

The above method is decomposed as follows. Taking two sampling modules150 including a first resistance value and a second resistance value,and the amplifying module 130 including two amplifications: the firstamplification and the second amplification as an example, the abovemethod is specifically described below.

It is assumed that the above power consumption measurement method isused for measuring the dynamic power consumption of the SDRAM chip. Forthe SDRAM chip, the current range of the circuit to be measured 110 ofthe SDRAM chip is 10 uA-500 mA, the convertible voltage range of theanalog-digital converter 121 is 10 mV-2V, and a sum of the voltage dropsof the gating module 140 and the sampling module 150 is less than orequal to 50 mV. In an exemplary implementation of the embodiments of thedisclosure, the resistance value of the gating module 140 when it isturned on is determined as 5 mΩ, and the resistance value of the gatingmodule 140 when it is turned off is greater than 10 KΩ. The resistancevalue of one of the sampling modules 150 is determined as a firstresistance value of 50 mΩ, and the resistance value of the othersampling module 150 is determined as a second resistance value of 10Ω.The amplification of the amplifying module 130 can be selected from thefirst amplification of 10 times and the second amplification of 100times.

Four state combinations may be obtained according to the two samplingmodules 150 and two amplifications: state 1, state 2, state 3 and state4. In each state, the range of the sum V1 of voltage drops across thegating module 140 and the sampling module 150, the range of the voltageV2 obtained by amplifying the voltage drop of the sampling module 150 bythe amplifying module 130 and the range of the measurable current I areas shown in Table 1.

TABLE 1 Resistance value of sampling State module V₁ Amplification V₂ I1 50 mΩ  1.1 mV-49.955 mV 10 10 mV-454.5 mV 20 mA-909 mA 2 50 mΩ 0.11mV-22 mV    100 10 mV-2 V      2 mA-400 mA 3 10 Ω 0.1 mV-20.01 mV 100 10mV-2 V     10 μA-2 mA  4 10 Ω 1 mV-50 mV  10 10 mV-499.8 mV  100μA-4.998 mA

As can be seen from the above calculation results shown in Table 1, inthe above four states, the voltages V2 amplified by the amplifyingmodule 130 are all within the convertible voltage range of 10 MV-2V ofthe analog-digital converter 121. In addition, the sums Vi of voltagedrops across the gate module 110 and sampling module 150 in each stateare all less than or equal to 50 mV.

In a practical application, since the current range of the circuit to bemeasured 110 in the SDRAM chip is 10 uA- 500 mA, the above statecombinations may be simplified, and three of the state combinations,i.e., state 1, state 2 and state 3, may be selected to meet themeasurement range of 10 μA-500 mA.

In an exemplary implementation of the embodiments of the disclosure, thespecific measurement ranges of the three states are adjusted, and theadjusted results are shown in Table 2.

TABLE 2 Resistance value of sampling State module V₁ Amplification V₂ I1 50 mΩ  22 mV-49.955 mV 10   200 mV-454.5 mV 400 mA-909 mA 2 50 mΩ 0.11mV-22 mV    100 10 mV-2 V  2 mA-400 mA 3 10 Ω 0.1 mV-20.01 mV 100 10mV-2 V 10 μA-2 mA 

Referring to FIG. 3, FIG. 3 schematically illustrates a flowchart of astate conversion procedure on a processing module according to anexemplary implementation of the embodiments of the disclosure. Thespecific conversion process is performed by the control logic module,the process specifically includes the following operations.

Firstly, each of components is powered on and initialized.

After the initialization, a first operation is performed. The gatingmodule is controlled to gate the sampling module with the firstresistance value (for example, 50 mΩ), and the amplifying module iscontrolled to adjust the amplification as the first amplification (forexample, 10 times), namely, state 1 is selected for measurement.

The amplifying module is controlled to acquire and amplify the voltagesignal across the gated sampling module.

A first current value I₁ and a first power consumption valuecorresponding to the amplified voltage signal are calculated.

The first current value I₁ is compared with a first lower limit value A₁(400 mA) of a measurable current range (400 mA-909 mA) corresponding tothe first resistance value and the first amplification, to determinewhether the first current value is less than the first lower limitvalue.

If yes, the procedure jumps to a second operation, which indicates thatthe state 1 is not able to be used for measuring the current range, andthe combination of state 2 is selected to measure current I.

If no, the first power consumption value is transmitted to the uppercomputer through the serial port of the processing module, and theprocedure proceeds to the first operation.

At the second operation, the gating module is controlled to gate thesampling module with the first resistance value (for example, 50 mΩ),and the amplifying module is controlled to adjust the amplification asthe second amplification (for example, 100 times), namely, state 2 isselected for measurement.

The amplifying module is controlled to acquire and amplify the voltagesignal across the gated sampling module.

A second current value I₂ and a second power consumption valuecorresponding to the amplified voltage signal are calculated.

The second current value I₂ is compared with a second lower limit valueA₂ (2 mA) of a measurable current range (2 mA-400 mA) corresponding tothe first resistance value and the second amplification and a firstupper limit value B₁ (400 mA) of the measurable current range (2 mA-400mA) corresponding to the first resistance value and the secondamplification, to determine whether the second current value is lessthan the second lower limit value, and whether the second current valueis greater than or equal to the first upper limit value.

If the second current value is less than the second lower limit value,the procedure jumps to a third operation, which indicates that the state2 is not able to be used for measuring the current range, and thecombination of state 3 is selected to measure current I.

If the second current value is greater than the first upper limit value,the procedure jumps to the first operation, which indicates that thestate 2 is not able to be used for measuring the current range, and thecombination of state 1 is selected to measure current I.

If no, the second power consumption value is transmitted to the uppercomputer through the serial port, and the procedure proceeds to thesecond operation.

At the third operation, the gating module is controlled to gate thesampling module with the second resistance value (for example, 10Ω), andthe amplifying module is controlled adjust the amplification as thesecond amplification (for example, 100 times), namely, state 3 isselected for measurement.

The amplifying module is controlled to acquire and amplify the voltagesignal across the gated sampling module.

A third current value I₃ and a third power consumption valuecorresponding to the amplified voltage signal are calculated.

The third current value I₃ is compared with a second upper limit valueB₂ (2 mA) of a measurable current range (10 μA-2 mA) corresponding tothe second resistance value and the second amplification, to determinewhether the third current value is greater than or equal to the secondupper limit value.

If yes, the procedure jumps to the second operation, which indicatesthat the state 3 is not able to be used for measuring the current range,and the combination of state 2 is selected to measure current I.

If no, the third power consumption value is transmitted to the uppercomputer through the serial port, and the procedure proceeds to performthe third operation.

In a practical application, the upper computer 200 may be a computerthat directly issues a control command, generally be a Personal Computer(PC), a host computer, a master computer, an upper computer, and thescreen of the upper computer may display various signal values (forexample, a maximum power consumption, a minimum power consumption and anaverage power consumption). The command from the upper computer 200 isfirstly transmitted to the processing module 120, and then theprocessing module 120 interprets the command into a corresponding timingsequence signal so as to control the operation of the correspondingcomponents directly. The processing module 120 feeds back the calculatedcurrent value and power consumption value to the upper computer 200through the serial port 122.

In an exemplary implementation, the upper computer 200 may use Pythonlanguage for programming, and use the strong third-party extensionlibrary to perform the graphical display and data analysis and mining ofthe measurement result. Specific operation flow may refer to FIG. 4,FIG. 4 schematically illustrates a flowchart of a procedure on an uppercomputer according to an exemplary implementation of the embodiments ofthe disclosure.

Firstly, the serial port is opened, the current value and powerconsumption value calculated by the processing module are received fromthe serial port, and displayed on a corresponding image box in realtime. Then, the current value and power consumption value are stored inthe upper computer, for example, the current value and power consumptionvalue are stored into different Comma-Separated Values (CSV) (orcharacter-separated values) files, in which table data is stored in aform of plain text. After the measurement of the power consumptionmeasurement assembly is completed, the system of the upper computer ispowered off, and the serial port is closed. A “data analysis” button onthe screen is clicked to enable the third-party extension library suchas Python to process the data, and results such as the maximum powerconsumption, the minimum power consumption and the average powerconsumption are obtained. Finally, the procedure is exited.

In an exemplary implementation of the embodiments of the disclosure, achip power consumption measurement device is further provided. In thefollowing, the description of the power consumption measurement assembly100 in the exemplary embodiments being applied in the chip 300 to obtainthe chip power consumption measurement device is illustrated.

Referring to FIG. 5, FIG. 5 schematically illustrates a schematicdiagram of a structure of a chip power consumption measurement deviceaccording to an exemplary implementation of the embodiments of thedisclosure. As illustrated in FIG. 5, the chip power consumptionmeasurement device specifically includes a chip 300 and the above powerconsumption measurement assembly 100. The at least two sampling modules150 of the power consumption measurement assembly 100 are respectivelyconnected to a power supply pin of the chip 300 in series, andconfigured to calculate the power consumption on the power supply. Thespecific details of the above power consumption measurement assembly 100have been described in detail in the above implementations, and will notbe elaborated herein.

In a practical application, the chip 300 may be one of various chipssuch as a

SDRAM chip and a CPU chip. In an exemplary implementation of theembodiments of the disclosure, the SDRAM chip is taken as an example todescribe the chip power consumption measurement device, and other typesof chips be implemented with reference to the SDRAM chip.

The SDRAM chip is generally installed on a mainboard 500, thus the powerconsumption measurement assembly 100 is arranged between the SDRAM chipand the mainboard 500. All power supply signals of the SDRAM chip areextended from the bottom layer of the SDRAM chip and connected to thesampling module 150 of the power consumption measurement assembly 100 inseries, and then are connected to the power supply pin of the SDRAMchip.

Referring to FIG. 5, in addition to the above power consumptionmeasurement assembly 100, the chip power consumption measurement devicemay further include an uplift plate 400, the uplift plate 400 may bearranged between the power consumption measurement assembly 100 and themainboard 500, so as to uplift the power consumption measurementassembly 100. Since a size of the power consumption measurement assembly100 is generally greater than that of the SDRAM chip, the uplift plateis arranged on the mainboard 500 to uplift the power consumptionmeasurement assembly 100, thus interference between the powerconsumption measurement assembly 100 and lateral components of the SDRAMchip can be avoided.

The position of the uplift plate 400 is the position where the SDRAMchip is originally arranged on the mainboard 500, therefore, a size ofthe uplift plate 400 may be designed based on the size of the SDRAMchip. For example, a cross-section dimension of the uplift plate 400 isthe same as that of the SDRAM chip, and a height of the uplift plate 400is greater than or equal to a thickness of the SDRAM chip. For example,the height of the uplift plate 400 may be 1.5-2.5 mm, which is notspecifically limited in the exemplary implementation.

Referring to FIG. 6, FIG. 6 schematically illustrates a schematicdiagram of a structure of another chip power consumption measurementdevice according to an exemplary implementation of the embodiments ofthe disclosure. As illustrated in FIG. 6, the uplift plate 400 may beset to include a plurality of sub-uplift plates 410, which areseparately arranged between the power consumption measurement assembly100 and the mainboard 500, so as to facilitate the heat radiation of thepower consumption measurement assembly 100.

In an exemplary implementation of the embodiments of the disclosure, theuplift plate 400 may be one of: and epoxy plate, an epoxy resin plate, abrominated epoxy resin plate, a glass fiber plate, a fiberglass board, areinforcing plate of a flexible printed circuit board, a flame retardantinsulation plate, an epoxy glass cloth plate, epoxy glass clothlaminated plate or a drilling shim plate of a circuit board, etc.

In conclusion, according to the chip power consumption measurementdevice provided with the above power consumption measurement assembly inthe exemplary embodiments, the control logic module in the processingmodule may determine the combination manner of the gated sampling moduleand the amplification of the amplifying module based on the currentrange of the circuit to be measured, the convertible voltage range ofthe analog-digital converter and the voltage drop range of the gatingmodule and the gated sampling module. Different current measurementranges may be obtained through various different combinations, so as tosatisfy the actual measurement requirements. Moreover, the componentsused in the measurement process are common components, instead ofhigh-end current measurement components with a high precision,therefore, the measurement cost of the measurement device is relativelylow, and the user requirements can be further satisfied.

Other embodiments of the embodiments of the disclosure will be apparentto those skilled in the art from consideration of the specification andpractice of the disclosure disclosed herein. The disclosure is intendedto cover any variations, uses, or adaptations of the embodiments of thedisclosure, and the variations, uses, or adaptations following thegeneral principles thereof and including such departures from theembodiments of the disclosure as come within known or customary practicein the art. The specification and embodiments are considered asexemplary only, with a true scope and spirit of the embodiments of thedisclosure being indicated by the claims.

It should be understood that the embodiments of the disclosure are notlimited to the exact construction that has been described above andillustrated in the accompanying drawings, and that various modificationsand changes may be made without departing from the scope thereof. Thescope of the embodiments of the disclosure is limited only by theappended claims.

What is claimed is:
 1. A power consumption measurement assembly, appliedto a circuit to be measured, the power consumption measurement assemblycomprising: at least two sampling circuitries, respectively connected tothe circuit to be measured in series; a gating circuitry, configured togate one of the at least two sampling circuitries; an amplifyingcircuitry, configured to acquire and amplify a voltage signal across thegated sampling circuitry; and a processing circuitry, connected to thegating circuitry and the amplifying circuitry, and configured to:control and adjust the gated sampling circuitry and an amplification ofthe amplifying circuitry, calculate a power consumption value based onthe amplified voltage signal and transmit the power consumption value.2. The power consumption measurement assembly of claim 1, wherein theprocessing circuitry comprises: an analog-digital converter, connectedto the amplifying circuitry and configured to convert the voltage signalto a digital signal; a calculation circuitry, configured to calculatethe power consumption value based on the digital signal; a control logiccircuitry, configured to control and adjust the gated sampling circuitryand the amplification of the amplifying circuitry; and a serial port,configured to connect to an upper computer and transmit the powerconsumption value to the upper computer.
 3. The power consumptionmeasurement assembly of claim 2, wherein the control logic circuitry isspecifically configured to: determine the gated sampling circuitry andthe amplification of the amplifying circuitry based on a current rangeof the circuit to be measured, a convertible voltage range of theanalog-digital converter and a voltage drop range of the gatingcircuitry and the gated sampling circuitry.
 4. The power consumptionmeasurement assembly of claim 2, wherein the amplifying circuitrycomprises at least two channels, an input of each of the at least twochannels is connected to two ends of a respective one of the at leasttwo sampling circuitries, and an output of each of the at least twochannels is connected to the analog-digital converter.
 5. The powerconsumption measurement assembly of claim 1, wherein the at least twosampling circuitries are at least two sampling resistors, the at leasttwo sampling resistors have different resistance values, and theamplifying circuitry comprises at least two selectable amplifications.6. The power consumption measurement assembly of claim 5, wherein aresistance value range of each of the at least two sampling resistors is50 mΩ-10Ω, and an amplification range of the amplifying circuitry is 10times-200 times.
 7. The power consumption measurement assembly of claim1, further comprising a substrate, and wherein the at least two samplingcircuitries, the gating circuitry, the amplifying circuitry and theprocessing circuitry are arranged on the substrate.
 8. A powerconsumption measurement method, applied to a power consumptionmeasurement assembly, the method comprising: controlling and adjusting agated sampling circuitry of the power consumption measurement assemblyand an amplification of an amplifying circuitry of the power consumptionmeasurement assembly; acquiring and amplifying a voltage signal acrossthe gated sampling circuitry; and calculating a power consumption valuebased on the amplified voltage signal and transmitting the powerconsumption value.
 9. The method of claim 8, further comprising:performing a current acquiring, wherein the current acquiring comprisescontrolling a gating circuitry of the power consumption measurementassembly to gate a sampling circuitry and controlling the amplificationof the amplifying circuitry; controlling the amplifying circuitry toacquire and amplify the voltage signal across the gated samplingcircuitry; calculating a current value and a power consumption valuecorresponding to the amplified voltage signal; comparing the currentvalue with a measurable current range of the power consumptionmeasurement assembly; in response to the current value being in themeasurable current range, transmitting the power consumption value andproceeding to the current acquiring; and in response to the currentvalue being not in the measurable current range, adjusting at least oneof the gated sampling circuitry or the amplification of the amplifyingcircuitry, and proceeding to the current acquiring.
 10. A chip powerconsumption measurement device, comprising: a chip; and a powerconsumption measurement assembly, wherein the power consumptionmeasurement assembly comprises: at least two sampling circuitriesrespectively connected to the chip in series; a gating circuitry,configured to gate one of the at least two sampling circuitries; anamplifying circuitry, configured to acquire and amplify a voltage signalacross the gated sampling circuitry; and a processing circuitry,connected to the gating circuitry and the amplifying circuitry, andconfigured to: control and adjust the gated sampling circuitry and anamplification of the amplifying circuitry, calculate a power consumptionvalue based on the amplified voltage signal and transmit the powerconsumption value; and wherein the at least two sampling circuitries ofthe power consumption measurement assembly are respectively connected toa power supply pin of the chip in series.
 11. The device of claim 10,further comprising: an uplift plate, arranged between the powerconsumption measurement assembly and a mainboard where the chip isarranged, and configured to uplift the power consumption measurementassembly.
 12. The device of claim 11, wherein a cross-section dimensionof the uplift plate is the same as a cross-section dimension of thechip, and a height of the uplift plate is greater than or equal to athickness of the chip.
 13. The device of claim 11, wherein the upliftplate is one of: an epoxy plate, an epoxy resin plate, a brominatedepoxy resin plate, a glass fiber plate, a fiberglass plate, areinforcing plate of a flexible printed circuit board, a flame retardantinsulation plate, an epoxy glass cloth plate, an epoxy glass clothlaminated plate or a drilling shim plate of a circuit board.
 14. Thedevice of claim 11, wherein the uplift plate comprises a plurality ofsub-uplift plates, and the plurality of sub-uplift plates are separatelyarranged between the power consumption measurement assembly and themainboard.
 15. The device of claim 10, wherein the chip is one of aSynchronous Dynamic Random Access Memory (SDRAM) chip or a CentralProcessing Unit (CPU) chip.
 16. The device of claim 10, wherein theprocessing circuitry comprises: an analog-digital converter, connectedto the amplifying circuitry and configured to convert the voltage signalto a digital signal; a calculation circuitry, configured to calculatethe power consumption value based on the digital signal; a control logiccircuitry, configured to control and adjust the gated sampling circuitryand the amplification of the amplifying circuitry; and a serial port,configured to connect to an upper computer and transmit the powerconsumption value to the upper computer.
 17. The device of claim 16,wherein the control logic circuitry is specifically configured to:determine the gated sampling circuitry and the amplification of theamplifying circuitry based on a current range of the chip, a convertiblevoltage range of the analog-digital converter and a voltage drop rangeof the gating circuitry and the gated sampling circuitry.
 18. The deviceof claim 16, wherein the amplifying circuitry comprises at least twochannels, an input of each of the at least two channels is connected totwo ends of a respective one of the at least two sampling circuitries,and an output of each of the at least two channels is connected to theanalog-digital converter.
 19. The device of claim 10, wherein the atleast two sampling circuitries are at least two sampling resistors, theat least two sampling resistors have different resistance values, andthe amplifying circuitry comprises at least two selectableamplifications.
 20. The device of claim 19, wherein a resistance valuerange of each of the at least two sampling resistors is 50 mΩ- 10Ω, andan amplification range of the amplifying circuitry is 10 times-200times.